Thursday, April 26, 2012

New Sale - Semiconductor Equipment Sale - Singapore

Bidding opens Thursday, May 17, 2012 9:00 AM and lots will start closing from Thursday, May 24, 2012 6:00 PM local time.

An online auction for over 100 lots of semiconductor equipment including wire bonders, molding machines, test equipment, forming, inspection machines and more.. To find out more or register, visit www.go-dove.com/event-16574.
Location: Singapore

Featured lots include:

  • Die bonders - Alphasem E8032
  • Wire bonders - Shinkawa UTC200, UTC335BI, UTC1000S
  • Molding machines - Fico Mold: AMS-i60-306; Siemens: Multiplunger system
  • Test machines - Datacon / Proaut SIP5D

For more information or to register visit www.go-dove.com/event-16574 or contact derrick.low@go-dove.com.



 Click here to find out more or register > 

GoIndustry DoveBid provides a global marketplace for buyers to source used industrial equipment from multinational manufacturing and R&D companies.

Find out more at www.go-dove.com or follow us on Twitter at www.twitter.com/Go_Dove.  If you want to follow postings relating to this event on Twitter use the hashtag #16574.

Alternatively, register to receive alerts about upcoming events, promotions and services at www.go-dove.com/login.asp?targetURL=%2faccounts%2freglite.asp.

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