Wednesday, July 25, 2012

Closing Now - Semiconductor Packaging and Testing Equipment

This event will be closing in the next few hours. To place a bid or find out more, visit

An online auction of high quality semiconductor packaging and testing equipment including PCB saw, die bonder, wire bonder, IC tester, wafer prober, memory tester, test handler, burn-in oven tester and much more.
Location: Zhucheng, Shandng Province, China

Featured lots include:

  • PCB saw - Disco EAD6361 + Intercon SBS808 solid BGA saw system (2003)
  • Grinder - Shibayama VG502MK118 (1993)
  • Die bonders - Alphasem SL9002/9006&SL9022 - (1996/2003)
  • Wire bonder - K&S 8020 (1999/2000)

For more information or to register to bid visit or contact so we can help you.

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