Tuesday, July 24, 2012

Closing Soon - Semiconductor Packaging and Testing Equipment

This event will be closing in less than 2 days. To place a bid or find out more, visit www.go-dove.com/event-16778.

An online auction of high quality semiconductor packaging and testing equipment including PCB saw, die bonder, wire bonder, IC tester, wafer prober, memory tester, test handler, burn-in oven tester and much more.
Location: Zhucheng, Shandng Province, China


Featured lots include:

  • PCB saw - Disco EAD6361 + Intercon SBS808 solid BGA saw system (2003)
  • Grinder - Shibayama VG502MK118 (1993)
  • Die bonders - Alphasem SL9002/9006&SL9022 - (1996/2003)
  • Wire bonder - K&S 8020 (1999/2000)

Bidding will remain open until Thursday, July 26, 2012 5:00 PM local time. For more information or to register to bid visit www.go-dove.com/event-16778 or contact aaron.zhou@go-dove.com so we can help you.

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 Click here to bid now or find out more > 

GoIndustry DoveBid provides a global marketplace for buyers to source used industrial equipment from multinational manufacturing and R&D companies.

Find out more at www.go-dove.com or follow us on Twitter at www.twitter.com/Go_Dove.  If you want to follow postings relating to this event on Twitter use the hashtag #16778.

Alternatively, register to receive alerts about upcoming events, promotions and services at www.go-dove.com/login.asp?targetURL=%2faccounts%2freglite.asp.

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