Friday, August 23, 2013

New Sale - Semiconductor Equipment Surplus Sale

Bidding opens Wednesday, September 11, 2013 9:00 AM and lots will start closing from Friday, September 13, 2013 7:00 PM local time.

An online auction for surplus Semiconductor used equipment located in Singapore. Items include wafer substrate bonder, wire and die bonder, plasma cleaner, wafer polisher and others equpment parts.

To find out more or register, visit www.go-dove.com/event-18121.
Location: Singapore

Featured lots include:

  • Wafer Substrate Bonder - Suss Microtec SB6 VAC
  • High Speed Personlization System - Muhlbauer
  • Die Bonder - Esec 2007
  • Wire Bonder - Kaijo FB700

For more information or to register visit www.go-dove.com/event-18121 or contact derrick.low@go-dove.com.

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 Click here to find out more or register > 

GoIndustry DoveBid provides a global marketplace for buyers to source used industrial equipment from multinational manufacturing and R&D companies.

Find out more at www.go-dove.com or follow us on Twitter at www.twitter.com/Go_Dove.  If you want to follow postings relating to this event on Twitter use the hashtag #18121.

Alternatively, register to receive alerts about upcoming events, promotions and services at www.go-dove.com/login.asp?targetURL=%2faccounts%2freglite.asp.

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