Tuesday, September 17, 2013

Closing Soon - Surplus Semiconductor Equipment

This event will be closing in less than 2 days. To place a bid or find out more, visit www.go-dove.com/event-18121.

An online auction for surplus Semiconductor used equipment located in Singapore. Items include wafer substrate bonder, wire and die bonder, plasma cleaner, wafer polisher and others equipment
Location: Singapore

Featured lots include:

  • Wafer Substrate Bonder - Suss Microtec SB6 VAC
  • High Speed Personlization System - Muhlbauer
  • Die Bonder - Esec 2007
  • Wire Bonder - Kaijo FB700

Bidding will remain open until Thursday, September 19, 2013 7:00 PM local time. For more information or to register to bid visit www.go-dove.com/event-18121 or contact derrick.low@go-dove.com so we can help you.

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 Click here to bid now or find out more > 

GoIndustry DoveBid provides a global marketplace for buyers to source used industrial equipment from multinational manufacturing and R&D companies.

Find out more at www.go-dove.com or follow us on Twitter at www.twitter.com/Go_Dove.  If you want to follow postings relating to this event on Twitter use the hashtag #18121.

Alternatively, register to receive alerts about upcoming events, promotions and services at www.go-dove.com/login.asp?targetURL=%2faccounts%2freglite.asp.