Tuesday, September 2, 2014

Closing Soon - ST-Ericsson Sale #3 - Semiconductor Backend Test & Assembly - Wafer Test, Handlers, Ovens and more.

This event will be closing in less than 2 days. To place a bid or find out more, visit international.go-dove.com/event-18815.

Due to the closing-down of remaining operations and clearing requirement of the storage facility before the end of 2014,  we offer for immediate sale ex site and on an exclusive basis, located in Shenzhen, China.

ST Ericsson was manufacturing wireless products and semiconductors since 2009, supplying these to mobile device manufacturers.

Sale of more equipment from other STE Manufacturing sites in ASIA are for sale through negotiation.
Please visit ST-Ericsson Private Treaty Sale - Semiconductor Backend Test & Assembly - Wafer Test, Handlers, Ovens and more. for more details.

Location: Shenzhen, China

Featured lots include:
  • Wire bonder - ESEC '3100' (Qty 14); '3100+' (Qty 16); ASM 'ABB339' (Qty 58)
  • Test System - Teradyne 'A585' (Qty 5); Teradyne 'Catalyst' (Qty 17)
  • Oxidation Analyzer - ASM 'EC913' (Qty 3)
  • Handler - SYNAX 'SX1107' (Qty 10); 'SX141' (Qty 8); 'SX1701' (Qty 10)

Bidding will remain open until Thursday, September 04, 2014 5:30 PM local time. For more information or to register to bid visit international.go-dove.com/event-18815 or contact eric.zhang@liquidityservices.com so we can help you.

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 Click here to bid now or find out more > 

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